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 CHIPS’
can handle virtually all of your wafer sawing and cutting needs for silicon, bumped
silicon, GaAs, SiGe, Glass, Quartz, and composite material wafers with
sizes up to and including 8"/200mm. CHIPS runs its saws on three
shifts for fast turnaround.
Single pass or progressive cutting can be used to perform either
saw-through or custom sawing at various depths. Coolant/wash is supplied
from our in-house de-ionized water system. All incoming wafers
are inspected prior to processing. CHIPS’ focus produces a
quality level in cleanly cut, particle free wafers and die, unparalleled
in the industry.
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